Facile approach of developing corrosion resistant superhydrophobic coating for copper
Abstract
A facile chemical route consisting of triethoxyoctylsilane modified SiO2 nanoparticles (~ 25 nm) was used to develop superhydrophobic coating on copper (Cu) to inhibit corrosion. A Cu substrate of 1 × 1 cm2 with a micron level pattern on its surface was produced using electrical discharge machine (EDM). The Piranha solution was used to produce micron-level uniform surface roughness on the Cu via chemical etching. A hierarchical micro and nano level roughness was created on the surface of Cu by immersing etched Cu in a solution of triethoxyoctylsilane modified SiO2 nanoparticles. The micro-nano roughness on Cu was revealed by optical microscopy, AFM and FESEM analysis. The coated Cu displayed a water CA of 155° ± 2° with a SA of 4° ± 2° compared to uncoated Cu (CA = 97° ± 3° and SA = 47° ± 3°. EIS plots validated the corrosion inhibition performance of the coated Cu outperformed the uncoated Cu.
